Jane Chen / Shanghai Daily news

German electronic giant Siemens (China) Co Ltd will push forward the cooperation with China's largest telecommunications equipment supplier in development of China-patent third-generation telecom products, the Beijing Times reported.
Christoph Caselitz, President of Siemens mobile Networks, and Guo Ping, vice president of Shenzhen Huawei Technologies Co Ltd, have signed an agreement in Hamburger, Germany, for their joint venture firm, now named TDTech, Siemens (China) announced yesterday.
Zeng Yanpei, China's vice Prime Minister attended the signing ceremony.
The joint venture was launched last year.  Its working staff has increased from 300 to 450.
With headquarters in Beijing, TDTech, an investment of US$100 million, will be engaged in developing, manufacturing and selling of technologies and products based on the TD-SCDMA, or Time Division - Synchronous Code Division Multiple Access, standard.
It will start outputting commercial-use 3G standard base station products in the middle of 2005.
The hybrid venture has developed TD-SCDMA base stations and wireless equipment.  After obtaining approval from the Ministry of Information Industry, it will start testing for the products from this month as planned.