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Siemens, Huawei agree on more development of 3G JV
2/12/2004 17:02

Jane Chen / Shanghai Daily news

German electronic giant Siemens (China) Co Ltd will increase cooperation with China's largest telecommunications equipment supplier in developing of China-patent third-generation telecom products, the Beijing Times reported.
Christoph Caselitz, President of Siemens mobile Networks, and Guo Ping, vice president of Shenzhen Huawei Technologies Co Ltd, signed an agreement in Hamburg, Germany, for their joint venture firm, TDTech, Siemens (China) announced yesterday.
Zeng Yanpei, China's vice Prime Minister attended the signing ceremony.
The joint venture, launched last year has seen its working staff increase from 300 to 450.
With headquarters in Beijing and an investment of US$100 million, TDTech will be engaged in developing, manufacturing and selling technologies and products based on the TD-SCDMA, or Time Division - Synchronous Code Division Multiple Access, standard.
It will start producing commercial-use 3G standard base station products from 2005.
The hybrid venture has developed TD-SCDMA base stations and wireless equipment.  After obtaining approval from the Ministry of Information Industry, the company plans to start testing the products this month.